4 commits

Author	SHA1	Message	Date
Duccio	3a15cb1614	Update bling mx fill zones	2022-05-18 09:41:57 +02:00
Duccio	a04cfa0bdf	Update bottom plate malformed edge cuts	2022-05-18 00:59:26 +02:00
Duccio	039183f5cf	Remove alignment target from Bling MX	2022-03-29 10:57:47 +02:00
Duccio	7dd19f8152	Remove pre-release warnings	2022-02-13 10:40:15 +01:00

Renamed from [PRE-RELEASE] Sweep Bling MX/bottom-plate/sweep-bling-mx__bottom.kicad_pcb (Browse further)